The industry standard for hermetic
package delidding.
Midas Technology has supplied delidding and hot gas rework equipment to defense, aerospace, and semiconductor manufacturers for over 35 years. Now with full Arizona-based engineering, sales, and support through Turnpack.
Equipment
Delidder Series
Precision IC package lid removal for die inspection, failure analysis, re-lidding, and rework.
- Applications Die inspection, failure analysis, re-lidding, rework
- Packages Ceramic, metal, and epoxy-sealed
- Configurations Manual and semi-automatic
- Control Adjustable removal force parameters
Hot Gas Rework Station
Controlled hot gas BGA and SMD rework, removal, and replacement with programmable temperature profiles.
- Applications BGA/SMD removal, replacement, rework
- Profiles Programmable temperature with thermocouple feedback
- Heating Precision nozzle-based with data logging
- Capability Component removal and replacement
Spare Parts & Tooling
We stock replacement parts for all Midas equipment. Fast turnaround, direct from manufacturer. No minimum order.
- ✓ Replacement bonding inserts and top tools
- ✓ Custom carrier trays and adapters
- ✓ Multi-pin needle kits
- ✓ Ejection tool adapters
- ✓ Support tooling and consumables
Industries We Serve
Defense & Aerospace
BAE Systems, Honeywell Aerospace, Lockheed Martin, Rafael, Crane Aerospace. 35 years of defense heritage.
Semiconductor
Molex ISI, MACOM, PCB Piezotronics. Die inspection, failure analysis, and rework tooling.
Contract Manufacturing
Labs, failure analysis shops, and contract electronics manufacturers requiring precision rework.